For SMD, I'd advise a 'hoof' style tip, which holds a small reservoir of solder.
Dragging this along the legs of an SMD device ( with a bunch of practice! ) will leave exactly the correct amount of solder on each leg, nicely separated by capillary forces.
You can get away with a normal fine tip if you can sweep it across the legs carefully whilst feeding thin solder, but bridging is more likely.
As with all soldering, preparation is everything.
The board and pads need to be utterly clean under magnification.
The PCB will usually have 'wells' in it around the pads, to help prevent bridging.
A syringe with flux is essential.
If using traditional solder, a tiny dab on the tip to affix 2 diagonal corners.
Then the hoof tip to run across the legs.
If using a reflow hot-air gun, then a syringe of flux/solder mix applied *sparingly*, and be careful not to blow the device off position with the airflow. The capillary forces will hold it in place, to an extent.
BTW, have you ever looked at solder paste under a microscope?
It's loads if tiny balls of solder ( like buckshot ) suspended in flux paste.
When you bring a reflow gun into play, the flux liquidises, and the little balls of solder roll about like balls in a kiddies ballpit.
It can be a right bugger to have them all 'join' into a designated bit of solder; you don't want stray balls left floating around. (!)